EV1HMC973LP3
Evaluation PCB HMC973LP3E
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Features

The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes.

Specifications


Pin Configuration

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Part Numbering System

Part Marking System

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Ordering Guide

Block Diagram

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관련상품