• 400W peak pulse power capability at 10/1000μs waveform, repetition rate(duty cycles): 0.01%
• Excellent clamping capability
• Typical IR less than 1μA when VBR min>12V
• For surface mounted applications to optimize board space
• Low profile package
• Typical failure mode is short from over-specified voltage or current
• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
• IEC 61000-4-2 ESD 30kV(Air), 30kV (Contact)
• ESD protection of data lines in accordance with IEC 61000-4-2
• EFT protection of data lines in accordance with IEC 61000-4-4
• Built-in strain relief
• Fast response time: typically less than 1.0ps from 0 Volts to VBR min
• Glass passivated junction
• Low inductance
• High temperature to reflow soldering guaranteed: 260°C/30sec
• VBR @ TJ = VBR@25°C x (1+αT x (TJ - 25))(αT: Temperature Coefficient, typical value is 0.1%)
• Plastic package is flammability rated V-0 per Underwriters Laboratories
• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS compliant
• Pb-free E3 means 2nd level interconnect is Pbfree and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD-609A.01)